宋畅,范正炼,马荣鑫,龙依婷.基于跌落仿真的集成灶包装优化设计[J].包装工程,2024,45(19):283-290.
SONG Chang,FAN Zhenglian,MA Rongxin,LONG Yiting.Optimization Design of Integrated Stove Packaging Based on Drop Simulation[J].Packaging Engineering,2024,45(19):283-290. |
| 基于跌落仿真的集成灶包装优化设计 |
| Optimization Design of Integrated Stove Packaging Based on Drop Simulation |
| 投稿时间：2024-05-09 |
| DOI：10.19554/j.cnki.1001-3563.2024.19.028 |
| 中文关键词: 集成灶 跌落 缓冲系数法 脆值 仿真 装柜量 等效塑性应变 |
| 英文关键词:integrated stove drop buffer coefficient method fragility simulation container loading quantity equivalent plastic strain |
| 基金项目: |
| 作者 | 单位 |
| 宋畅 | 广东美的厨卫电器制造有限公司，广东 佛山 528000 |
| 范正炼 | 广东美的厨卫电器制造有限公司，广东 佛山 528000 |
| 马荣鑫 | 广东美的厨卫电器制造有限公司，广东 佛山 528000 |
| 龙依婷 | 广东美的厨卫电器制造有限公司，广东 佛山 528000 |
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| Author | Institution |
| SONG Chang | Guangdong Midea Kitchen Electric Manufacturing Co., Ltd., Guangdong Foshan 528000, China |
| FAN Zhenglian | Guangdong Midea Kitchen Electric Manufacturing Co., Ltd., Guangdong Foshan 528000, China |
| MA Rongxin | Guangdong Midea Kitchen Electric Manufacturing Co., Ltd., Guangdong Foshan 528000, China |
| LONG Yiting | Guangdong Midea Kitchen Electric Manufacturing Co., Ltd., Guangdong Foshan 528000, China |
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| 中文摘要: |
| 目的 对集成灶的跌落缓冲包装进行原始的设计及优化，要求通过实体样机测试验证并满足装柜量要求。方法 首先，用缓冲系数法对包装进行初始设计得到最小厚度;其次，用ABAQUS建立跌落有限元模型做模拟测试，获取精确的脆值来校准最小厚度，以进行装柜尺寸约束判定;最后，通过仿真位移云图和等效塑性应变云图做跌落过程的失效分析，对包装进行局部优化。改善前后的方案同步做实体样机测试验证。结果 仿真模型的云图显示，基于包装优化方案的侧板等效塑性应变从0.158降低到0.020，达到了仿真判定合格的标准，与测试结果一致，同时装柜量能得到保证。结论 仿真模型与缓冲系数法结合的设计方法，能有效指导包装设计，节约测试资源，缩短开发周期。 |
| 英文摘要: |
| The work aims to design and optimize the drop buffer packaging of integrated stoves and verify the packaging by physical prototype test and ensure that it is in line with the requirements of container loading quantity. The minimum thickness was obtained from the initial design of the packaging carried out by the buffer coefficient method. Then, a finite element model simulating drop test was established by ABAQUS to obtain accurate fragility to adjust the minimum thickness, thus determining whether the packaging dimension met the constraints. Finally, local optimization of the packaging was carried out based on failure analysis of the drop process through displacement cloud map and equivalent plastic strain cloud map. Meanwhile, the schemes before and after improvement were verified by physical prototype test. The cloud map of the simulation model showed that the equivalent plastic strain of the side panel based on the optimized packaging was reduced from 0.158 to 0.020, meeting the qualified standard of simulation judgment and matching with the test results while ensuring the container loading quantity. The design method combining simulation models and buffer coefficients method can guide packaging design effectively, saving test resources and shortening the development cycle. |
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