李志强,王杰,赵怡怡,王哲,刘迪.单晶硅片循环包装设计与可靠性分析[J].包装工程,2024,45(5):286-291.
LI Zhiqiang,WANG Jie,ZHAO Yiyi,WANG Zhe,LIU Di.Design and Reliability Analysis of Circular Packaging for Monocrystalline Silicon Wafer[J].Packaging Engineering,2024,45(5):286-291. |
| 单晶硅片循环包装设计与可靠性分析 |
| Design and Reliability Analysis of Circular Packaging for Monocrystalline Silicon Wafer |
| 投稿时间：2023-08-28 |
| DOI：10.19554/j.cnki.1001-3563.2024.05.034 |
| 中文关键词: 单晶硅片 循环包装 跌落仿真 可靠性分析 |
| 英文关键词: monocrystalline silicon wafer cyclic packaging drop simulation reliability analysis |
| 基金项目:教育部“蓝火计划”(惠州)产学研联合创新资金项目(CXZJHZ201806) |
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| 中文摘要: |
| 目的 以某公司M10型单晶硅片为研究对象，基于缓冲包装六步法及4R1D原则设计安全经济的单晶硅片循环包装方案。方法 使用Creo软件建立3D模型，利用ANSYS LS-DYNA进行堆码跌落仿真，结合跌落试验结果验证包装的可靠性。结果 动态跌落仿真在角跌落工况下，跌落角产生最大应力为34.42 MPa，小于包装箱许用应力40 MPa;产品最大响应加速度为38.71g，发生在棱跌落工况，小于产品脆值50g。试验与仿真平均误差为8.30%，在450 mm跌落高度下。使用此循环包装方案，产品整体破损率降低了8.02%。结论 此循环包装的安全性、便利性和经济性优于现有一次性包装的。 |
| 英文摘要: |
| The work aims to design a safe and economical circular packaging scheme for monocrystalline silicon wafer based on the six-step buffer packaging and 4R1D principle with M10 monocrystalline silicon wafer of a company as the research object. A 3D model was established by Creo software, and the stacking drop was simulated by ANSYS LS-DYNA. The packaging reliability was verified by the drop test results. The results showed that the maximum stress produced by the falling angle was 34.42 MPa, which was less than the allowable stress of the packing box of 40 MPa. The maximum response acceleration of the product was 38.71g, which was less than the brittle value of the product of 50g. The average error between experiment and simulation was 8.30%. Under the drop height of 450 mm, the overall breakage rate of the product was reduced by 8.02% by using this recycling packaging scheme. To sum up, the safety, convenience and economy of this recycling package are superior to the existing disposable packaging. |
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