卢晓,张亮,王曦,李木兰.电子封装用Sn‒Ag‒Cu低银无铅钎料研究进展及发展趋势[J].包装工程,2022,43(23):118-136.
LU Xiao,ZHANG Liang,WANG Xi,LI Mu-lan.Research Progress and Prospect of Low-Ag Lead-free Sn-Ag-Cu Solder in Electronic Packaging[J].Packaging Engineering,2022,43(23):118-136. |
| 电子封装用Sn‒Ag‒Cu低银无铅钎料研究进展及发展趋势 |
| Research Progress and Prospect of Low-Ag Lead-free Sn-Ag-Cu Solder in Electronic Packaging |
| |
| DOI：10.19554/j.cnki.1001-3563.2022.23.015 |
| 中文关键词: 电子封装 低银钎料 显微组织 纳米颗粒 |
| 英文关键词: electronic packaging low-Ag solder corrosion resistance particle strengthening |
| 基金项目:江苏省自然科学基金(BK20211351) |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 为了适应高银钎料向低银钎料转变的发展趋势，综述近年来对低银SnAgCu钎料的最新研究，展示其在电子封装材料领域中宽广的应用前景。方法 通过分析国内外有关低银钎料的研究成果，详细介绍合金化和颗粒强化等方法对低银钎料熔化特性、润湿性、显微结构、界面组织、力学性能的影响，重点总结元素掺杂的最佳添加量以及改性机理。结论 通过添加金属元素、稀土元素、纳米颗粒，采用新型搅拌技术能有效提升钎料性能，部分改性后的低银复合钎料性能达到了高银钎料性能水平。 |
| 英文摘要: |
| The work aims to review the latest research on low-Ag Sn-Ag-Cu solder in recent years to demonstrate its broad application prospects in the field of electronic packaging materials, so as to meet the development trend of high-Ag solder to low-Ag solder. Through the analysis on the research results of low-Ag solder at home and abroad, the effects of alloying and particle strengthening on the melting characteristics, wettability, microstructure, interface structure and mechanical properties of low-Ag solder were introduced in detail. The optimum addition amount of element doping and the modification mechanism were summarized. As a result, by adding metal elements, rare earth elements and nanoparticles, the new stirring technology can effectively improve the properties of the solder. The properties of partially modified low-Ag composite solder reach the level of high-Ag solder. |
|
查看全文
查看/发表评论 下载PDF阅读器 |
| 关闭 |
渝公网安备 50010702501716号