车娟,李红斌.香菇菌棒包装袋撑圆装置关键技术研究[J].包装工程,2022,43(15):308-314.
CHE Juan,LI Hong-bin.Key Technology of Round Supporting Device for Lentinus Edodes Stick Packaging Bag[J].Packaging Engineering,2022,43(15):308-314. |
| 香菇菌棒包装袋撑圆装置关键技术研究 |
| Key Technology of Round Supporting Device for Lentinus Edodes Stick Packaging Bag |
| |
| DOI：10.19554/j.cnki.1001-3563.2022.15.036 |
| 中文关键词: 香菇 包装袋 撑圆装置 结构设计 |
| 英文关键词: lentinus edodes packaging bag sound supporting device structure design |
| 基金项目:江苏省第二批职业教育教师教学创新团队(苏教办师函〔2021〕22号);2020年江苏省高等教育学会专项课题(2020NDKT050) |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 为了提高香菇包装机的包装效率，提升包装机的整体性能。方法 首先分析研究包装袋基本参数、拉伸特性、人工套袋方式，通过类比人工套袋得到撑圆装置设计方案。基于此方案，对撑圆装置的关键结构尺寸参数进行详细设计。结果 建立了三维模型并导入Ansys进行静力学分析，得到了撑圆装置的应力分布云图。撑圆机构动作过程中受到的最大压应力为2.48 MPa，远小于树脂材料弯曲强度67 MPa;最大变形量为0.175 mm，出现在撑圆机构最前端，不影响后序动作。结论 文中证明了撑圆装置结构设计的合理性和模型建立的准确性，为同类型结构的设计提供一定的理论参考。 |
| 英文摘要: |
| The work aims to improve the packaging efficiency of the lentinus edodes packaging machine and improve the overall performance of the packaging machine. First, basic parameters, stretching characteristics and manual packaging methods of the packaging bag were analyzed and studied. The design scheme of the round supporting device was obtained by analogy with manual packaging. Based on this scheme, the key structural dimension parameters of the round supporting device were designed in detail. The 3D model was established and imported into ANSYS for static analysis to get the force distribution pattern. The results showed that the maximum pressure stress of the round supporting mechanism during action was 2.48 MPa, which was much smaller than the bending strength of resin 67 MPa. The maximum strain was 0.175 mm, which happened at the front end of the round supporting mechanism. It did not affect the post sequence action. The design rationality of the round supporting device and the accuracy of model established are proved. It provides a certain theoretical reference for design of similar structures. |
|
查看全文
查看/发表评论 下载PDF阅读器 |
| 关闭 |
渝公网安备 50010702501716号