杨明,陈娟芳,王亚利.半导体精密控温技术在航天器包装容器的应用[J].包装工程,2021,42(11):176-181.
YANG Ming,CHEN Juan-fang,WANG Ya-li.Application of Precision Temperature Control Technology in Spacecraft Transportation and Packaging Container[J].Packaging Engineering,2021,42(11):176-181. |
| 半导体精密控温技术在航天器包装容器的应用 |
| Application of Precision Temperature Control Technology in Spacecraft Transportation and Packaging Container |
| 投稿时间：2020-10-23 |
| DOI：10.19554/j.cnki.1001-3563.2021.11.026 |
| 中文关键词: 航天器 半导体 控温 |
| 英文关键词: spacecraft semiconductor temperature control |
| 基金项目:国家自然科学基金(11502145) |
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| 中文摘要: |
| 目的 对某型号航天器包装容器进行温控系统设计，以达到航天器高精度控温的要求。方法 对总体保温布局进行设计，优化被动保温结构，采用半导体控温方式，利用Ansys Workbench进行稳态和瞬态热力学分析。通过试验测试，验证保温结构设计和热力学分析结果的合理性。结果 在外部施加热源温度36 ℃和0 ℃情况下，随着热源区域的远离，包装容器内部的温度也趋于平稳，内部装载产品区域温度基本能维持在20.99～22.662 ℃。实际试验结果显示箱内温度变化不大于±1 ℃，比传统的空调控温精度高出70%左右。结论 通过优化箱体的被动保温结构，采用半导体精密控温，可以满足未来航天器小型化、高精度运输要求。 |
| 英文摘要: |
| The paper describes the aim at designing a temperature control system of a certain type of spacecraft to meet the requirements of high-precision temperature control. After the design of overall insulation layout and optimization of passive insulation structure and semiconductor temperature control mode is used to analyze steady and transient thermodynamic using ANSYS workbench. The rationality of thermal insulation structure design and thermodynamic analysis is verified thorough tests. Under external thermal load of 36 ℃ and 0 ℃, the temperature inside the packaging container tends to be stable as the distance of the thermal load area moves away. The temperature of the inner loading area can be maintained at 20.99 ℃ and 22.662 ℃. The conclusion is that by optimizing the passive insulation structure of the packaging container and adopting semiconductor precision temperature control, the requirements of miniaturization and high-precision transportation of future spacecraft can be met. |
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