文章摘要
杜言莉,王欢,龚伟,陶斐.氮化硼及其在导热复合材料中的研究进展[J].包装工程,2018,39(21):72-79.
DU Yan-li,WANG Huan,GONG Wei,TAO Fei.Research Progress of Boron Nitride and Its Application in Thermal Conductivity Composites.Packaging Engineering,2018,39(21):72-79.
氮化硼及其在导热复合材料中的研究进展
Research Progress of Boron Nitride and Its Application in Thermal Conductivity Composites
投稿时间:2018-06-20  修订日期:2018-11-10
DOI:10.19554/j.cnki.1001-3563.2018.21.014
中文关键词: 聚合物  氮化硼  导热绝缘复合材料  热导率
英文关键词: polymer  boron nitride  thermal conductive insulating composite  thermal conductivity
基金项目:
作者单位
杜言莉 1.核工业203所咸阳 712000 
王欢 2.西安理工大学西安 710048 
龚伟 2.西安理工大学西安 710048 
陶斐 2.西安理工大学西安 710048 
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中文摘要:
      目的 从氮化硼的表面改性、取向结构、形态含量以及杂化填料等4个方面介绍氮化硼填充导热复合材料的基础研究进展,为导热聚合物在电子封装领域的应用提供一定的研究思路。方法 通过对近年来国内外的相关文献进行分析和总结,归纳出微/纳氮化硼的产业化制备方法以及产品性能,并介绍微/纳氮化硼填料对聚合物基复合材料导热性能影响的研究情况。结论 氮化硼各方面均具有优异的性能,可用于制备填充型高导热复合材料。
英文摘要:
      This paper introduced the basic research progress of boron nitride (BN) filled thermal conductive composites from four aspects: surface modification, orientation structure, morphology and content of BN filler as well as hybrid fillers, which provided some research ideas for application of thermal conductive polymers in the field of electronic packaging. Based on analysis and summary of the related literatures at home and abroad in recent years, the industrial preparation methods and product properties of micro/nano BN were summarized. Then, the research progress of micro/nano-BN fillers on the thermal conductivity of polymer matrix composites was introduced. Then the thermal conducting mechanism of the composites was discussed. The excellent properties of BN make it possible to prepare filled high thermal conductive composites.
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