王雪姣,李新娥.基于可靠性的智能电子标签壳体方案优化设计[J].包装工程,2018,39(7):11-15.
WANG Xue-jiao,LI Xin-e.Optimization of Scheme Design of Intelligent Electronic Tag Housing Based on Reliability[J].Packaging Engineering,2018,39(7):11-15. |
| 基于可靠性的智能电子标签壳体方案优化设计 |
| Optimization of Scheme Design of Intelligent Electronic Tag Housing Based on Reliability |
| 投稿时间：2017-06-07 修订日期：2018-04-10 |
| DOI：10.19554/j.cnki.1001-3563.2018.07.003 |
| 中文关键词: 贮运监测 电子标签 可靠性 壳体设计 Ansys |
| 英文关键词: storage, transportation and monitoring electronic tag reliability housing design Ansys |
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| 中文摘要: |
| 目的 为了不影响外包装的总体结构和包装方式，对安装在外包装上的电子标签进行微型化设计。同时，针对电子标签壳体可能由于外部特殊情况造成破损的情况，对其进行可靠性分析。方法 通过Ansys软件对基于空间最大化原则设计的壳体的抗压、抗冲击性进行仿真分析。结果 在z方向施加了2 MPa的压强下最大变形量为2.8 mm，不能满足抗压性需求，进而提出了基于结构最优化原则的壳体设计方案。经仿真分析，壳体z方向在2 MPa静压的最大变形量为0.2 mm，较优化前降低了2.6 mm。结论 智能电子标签经过优化后，具有微型化、高可靠性的特点，满足系统的应用需求。 |
| 英文摘要: |
| The work aims to conduct the microscale design of electronic tag on the outer package so as not to affect the overall structure and way of packaging of the outer package, and analyze the reliability of electronic tag housing with respect to the situation that the housing might be damaged due to the special external circumstances. The compression and impact resistance of the housing designed based on the principle of space maximization through the Ansys software were simulated and analyzed. Under the 2 MPa pressure applied in the z direction, the maximum deformation was 2.8 mm, which could not meet the compression resistance requirements. Then, the housing design scheme based on the principle of structural optimization was put forward. After simulation analysis, the maximum deformation of the housing under a static pressure of 2 MPa applied in the z direction was 0.2 mm, 2.6 mm lower than that before the optimization. After optimized, the intelligent electronic tag is featured by micromation and high reliability, and meets the application requirements of the system. |
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