王园,武吉梅,陈彦.壁纸包装机烘箱温度场模拟及结构改进[J].包装工程,2017,38(13):184-188.
WANG Yuan,WU Ji-mei,CHEN Yan.Temperature Field Simulation and Structure Improvement of Wallpaper Packaging Machine Oven[J].Packaging Engineering,2017,38(13):184-188. |
| 壁纸包装机烘箱温度场模拟及结构改进 |
| Temperature Field Simulation and Structure Improvement of Wallpaper Packaging Machine Oven |
| 投稿时间：2016-12-15 修订日期：2017-07-10 |
| DOI： |
| 中文关键词: 壁纸包装机 烘箱 FLUENT 温度场 结构改进 |
| 英文关键词: wallpaper packaging machine oven FLUENT temperature field structure improvement |
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| 中文摘要: |
| 目的 采用有限元数值模拟方法分析壁纸包装机温度场的均匀性，以提高包装质量。方法 创建包装机烘箱三维模型，通过FLUENT对工作过程温度场进行模拟分析，针对分析结果中的影响因素进行结构改进。结果 得到了壁纸包装机烘箱内部温度场的分布情况，找到了影响烘箱温度场均匀性的因素，通过对壁纸包装机烘箱结构进行改进，提高了内部温度的均匀性。结论 通过对烘箱内部喷风口和出风口结构进行部分改进，有效地改善了烘箱温度均匀性，提高了包装效率。 |
| 英文摘要: |
| The work aims to analyze the uniformity of wallpaper packaging machine temperature field by using the finite element numerical simulation method, so as to improve the packaging quality. The temperature field of the working process was simulated and analyzed via FLUENT by creating 3D model for packaging machine oven. The structure was improved with respect to the influence factors in the analysis results. The distribution of temperature field in the wallpaper packaging machine oven was obtained and the factors that affected the uniformity of oven temperature field were found out. The uniformity of internal temperatures was intensified by improving the structure of wallpaper packaging machine oven. The oven temperature uniformity and packaging efficiency can be effectively improved by partly changing the structures of air inlet and outlet of the oven. |
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