文章摘要
池腾腾,王南,周莎莎,刘庆阳.一种并联机构运动副摆放位置不同的静力学分析[J].包装工程,2016,37(17):157-161.
CHI Teng-teng,WANG Nan,ZHOU Sha-sha,LIU Qing-yang.Statics Analysis of A Parallel Mechanism with Different Placement Positions[J].Packaging Engineering,2016,37(17):157-161.
一种并联机构运动副摆放位置不同的静力学分析
Statics Analysis of A Parallel Mechanism with Different Placement Positions
投稿时间:2015-11-01  修订日期:2016-09-10
DOI:
中文关键词: 并联机构  螺旋理论  静力学  Matlab
英文关键词: parallel mechanism  screw theory  statics  Matlab
基金项目:国家自然科学基金(51075118)
作者单位
池腾腾 河北工程大学邯郸 056038 
王南 河北工程大学邯郸 056038 
周莎莎 河北工程大学邯郸 056038 
刘庆阳 河北工程大学邯郸 056038 
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中文摘要:
      目的 运用螺旋理论在Matlab平台上对一种封装并联机构2-RPU/SPR,以及因其运动副摆放位置不同衍生出的3种两转一移并联机构2-UPR/SPR,2-UPR/RPS和2-RPU/RPS的静力学特性进行分析,并比较它们的优劣性。方法 文中采用螺旋理论法对4种并联机构建立静力学数学模型,进而运用Matlab编程软件建立4个机构的程序模型,在Matlab中分2种情况对4个机构进行静力学分析。结果 机构2-RPU/SPR的驱动力与其他3个机构相比相对较小;机构2-RPU/SPR的等效约束力和驱动力与其他3个机构相比变化波动较小。在动平台输出相同的情况下,机构2-RPU/SPR易于控制与驱动,灵活性高于其他3个机构;在动平台位姿相同的情况下,机构2-RPU/SPR抗外界干扰的能力优于其他3个机构。结论 并联机构2-RPU/SPR比另外3个并联机构更好,在高精度包装工程中更具有实际应用前景。
英文摘要:
      It aims to analyze the statics characteristics of packaging parallel mechanism 2-RPU/SPR and other three kinds of 2R1T parallel mechanisms 2-UPR/SPR, 2-UPR/RPS and 2-RPU/RPS derived from its different placement positions of motion pair based on Matlab and make comparison among them. Mathematical model of statics was created by screw theory method for the four parallel mechanisms; and then programming models were established by Matlab software. Statics characteristics were analyzed for the four mechanisms by Matlab in two circumstances. The driving force of 2-RPU/SPR was relatively small compared with other three mechanisms; the equivalent force and driving force of 2-RPU/SPR changed less than the other three mechanisms. Under the same output of mobile platform, 2-RPU/SPR was easier to control and drive, and its flexibility was higher than the other three. Under the same pose of mobile platform, the anti-interference ability of 2-RPU/SPR was better. To sum up, the parallel mechanism 2-RPU/SPR is better than the other three mechanisms. It has more practical application prospect in high precision packaging engineering.
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