张哲源,李博,严欢,孙昊,王利强,钱怡,张新昌.改性大豆蛋白用于轻质代木包装材料的制备[J].包装工程,2016,37(15):72-77.
ZHANG Zhe-yuan,LI Bo,YAN Huan,SUN Hao,WANG Li-qiang,QIAN Yi,ZHANG Xin-chang.Preparation of Lightweight Wood Substitute Packaging Material by Modified Soy Protein Adhesive[J].Packaging Engineering,2016,37(15):72-77. |
| 改性大豆蛋白用于轻质代木包装材料的制备 |
| Preparation of Lightweight Wood Substitute Packaging Material by Modified Soy Protein Adhesive |
| 投稿时间：2016-01-23 修订日期：2016-08-10 |
| DOI： |
| 中文关键词: 轻质代木材料 废纸纤维 秸秆 大豆蛋白 改性剂 复配剂 |
| 英文关键词: lightweight wood substitute material waste paper fiber straw SPI modifier mixture |
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| 中文摘要: |
| 目的 以大豆蛋白为胶粘剂，制备轻质代木包装材料并研究其性能。方法 以不同形态和配比的废旧瓦楞纸板、小麦秸秆为基材，以大豆分离蛋白(SPI)为胶粘剂，通过热压工艺制备轻质代木包装材料并对材料性能进行测试，从而确定最佳配方及工艺参数。结果 改性剂、复配剂、基材、工艺参数的选择与材料性能密切相关，当NaOH，Ca(OH)2，CMCNa，Na2B4O7•10H2O，SPI，水，纸纤维和秸秆质量比为0.01︰0.01︰0.2︰0.06︰1︰10︰7︰3，热压参数为热压温度140 ℃，热压时间为30 min时，方案最优，微波预热能使热压时间减至11 min，最终制得的轻质代木包装材料密度为550 kg/m3，静曲强度为18.38 MPa，弹性模量为1926.73 MPa，符合相关标准。结论 SPI改性及复配能改善其胶粘性和防水性，微波预热能提高热压效率与试样性能，以制备满足一定性能要求的零甲醛释放轻质代木包装材料。 |
| 英文摘要: |
| It aims to prepare a lightweight wood substitute packaging material using soy protein as the adhesive and study its properties. Lightweight wood packaging material was hot pressed by using different forms and proportions of waste corrugated cardboard and wheat straw as substrate and modified and mixed soy protein isolate (SPI) in different ways as adhesive. Then material properties were tested to determine the optimal formula and process parameters. Selection of modifiers, mixture, substrate and process parameters was closely related to the material properties. When the proportion of NaOH, Ca (OH)2, CMCNa, Na2B4O7•10H2O, SPI, water, paper fiber and straw weight was 0.01︰0.01︰0.2︰0.06︰1︰10︰7︰3, hot pressing parameters temperature at 140 ℃ and pressing time 30 min, the proposal was optimal. Microwave preheating could obviously shorten the hot pressing cycle and improve the sample performance. When the hot pressing time was reduced to 11 min, the density of light wood substitute packaging material was 550 kg/m3, bending strength 18.38 MPa, and elastic modulus 1926.73 MPa, which complied with relevant standards. In conclusion, the modification and compounding of SPI can improve its adhesion and water resistance; microwave heating can improve the thermal efficiency and the sample performance. Therefore, it can be used for the preparation of lightweight wood substitute packaging materials with zero formaldehyde release. |
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