滑广军,费伟民,谢勇.缓冲包装跌落仿真误差分析[J].包装工程,2016,37(13):54-59.
HUA Guang-jun,FEI wei-min,XIE Yong.Drop Simulation Errors of Cushioning Packaging[J].Packaging Engineering,2016,37(13):54-59. |
| 缓冲包装跌落仿真误差分析 |
| Drop Simulation Errors of Cushioning Packaging |
| 投稿时间：2015-12-26 修订日期：2016-07-10 |
| DOI： |
| 中文关键词: Ansys/LS-DYNA DTM 缓冲包装设计 跌落仿真 |
| 英文关键词: Ansys/LS-DYNA DTM cushioning packaging design drop simulation |
| 基金项目:湖南省科技计划（2015JC3114） ；湖南工业大学研究生创新基金（cx1501） |
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| 中文摘要: |
| 目的 研究 Ansys/LS-DYNA DTM 模块跌落仿真分析与经典缓冲包装设计方法之间的误差，并分析阻尼及摩擦因数对仿真结果的影响。 方法 基于经典缓冲包装设计方法，分别设计线弹性与双线性材料为缓冲材料的产品-衬垫系统；利用 Ansys/LS-DYNA DTM 模块对线弹性与双线性缓冲材料的产品-衬垫系统进行跌落分析，对比分析理论设计与仿真分析结果。 结果 对于线弹性材料与双线性缓冲材料的产品-衬垫系统，Ansys/LS-DYNA DTM 模块跌落仿真分析与经典缓冲包装理论设计之间的误差均在 5%以内。系统阻尼的增加导致所受最大冲击加速度减小；摩擦因数对所受最大冲击加速度影响较小；线性粘滞系数的增加导致所受最大冲击加速度增加。 结论 对于一般的工程应用， Ansys/LS-DYNA DTM 模块跌落仿真分析方法与经典缓冲包装设计方法之间的误差在允许范围内。 |
| 英文摘要: |
| This paper aimed to study the error between the Ansys/LS-DYNA DTM module drop simulation analysis and the classical method of cushioning packaging design, as well as the influence of damping and friction coefficient on the simulation result. Based on the classical method of cushioning packaging design, product-liner systems using cushioning material with linear elasticity or bilinearity were designed respectively. By analyzing the drop of the liner systems with Ansys/LS-DYNA DTM module, the theoretical design and the result of simulation analysis were comparatively analyzed. For both liner systems using cushioning material with linear elasticity and bilinearity, the error between the Ansys/LS-DYNA DTM module drop simulation analysis and the classical method of cushioning packaging design was no more than 5%. The increasing damping led to the decrease of the maximum impact acceleration; the friction coefficient had little effect on the maximum impact acceleration; increasing linear viscous coefficient caused the increase of maximum impact acceleration. In conclusion, the error between the drop simulation analysis with Ansys/LS-DYNA DTM module and the classical method of cushioning packaging design was acceptable for general engineering applications. |
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