徐淑权,黄立果,蔡建,秦旭锋,白焘,汪道全.发射箱用RTM树脂体系工艺性与固化性能研究[J].包装工程,2016,37(1):115-119.
XU Shu-quan,HUANG Li-guo,CAI Jian,QIN Xu-feng,BAI Tao,WANG Dao-quan.Process and Curing Properties of RTM Resin System for Launch Box[J].Packaging Engineering,2016,37(1):115-119. |
| 发射箱用RTM树脂体系工艺性与固化性能研究 |
| Process and Curing Properties of RTM Resin System for Launch Box |
| 投稿时间：2015-03-29 修订日期：2016-01-10 |
| DOI： |
| 中文关键词: RTM 黏度 固化性能 |
| 英文关键词: RTM viscosity curing performance |
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| 中文摘要: |
| 目的 研究环氧树脂体系的黏度及固化性能， 为利用树脂传递模塑（RTM）工艺制造发射箱提供理论依据。方法 采用旋转黏度计测试了E-51环氧树脂体系的动态黏度和静态黏度， 用非等温DSC法和平板小刀法研究了树脂体系的固化行为。结果 在60~80 ℃下70 min， 树脂体系的黏度仍小于1000 mPa·s， 符合工艺要求， 并推导出了固化温度参数分别为60， 125， 180 ℃， 以及凝胶时间与温度的关系方程。结论 温度区间60~80 ℃可作为发射箱RTM工艺的操作区间， 建议固化工艺制度为60，90， 125 ℃下分别加热固化3.5， 2， 1 h， 后处理工艺为180 ℃下加热固化1 h。 |
| 英文摘要: |
| The aim of this work was to study the viscosity and curing properties of epoxy resin system, in order to provide a theoretical basis for manufacturing launch box using RTM process. The dynamic viscosity and static viscosity of the E-51epoxy resin system were tested by rotational viscometer. The curing behavior of the resin system was studied using the non-isothermal DSC method and Flat knife method. The viscosity of the resin system was still less than 1000 mPa·s after 70 min at 60~80 ℃, which met the process requirements. And it was deduced that the curing temperature parameter was 60, 125 and 180 ℃ respectively, as well as the relationship equation of gel time and temperature. The temperature range 60~80 ℃ could be used as the operating range for RTM process to manufacture launch box. The recommended curing process of system was heat curing 3.5, 2 and 1 h at 60,90 and 125 ℃respectively, post-treatment process for the next 1h at 180 ℃. |
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