石路晶,贾长明.导热高分子材料在电子封装领域应用研究[J].包装工程,2014,35(17):127-130,134.
SHI Lu-jing,JIA Chang-ming.Research Advances in Application of Thermally Conductive Polymer Material in Electronic Packaging[J].Packaging Engineering,2014,35(17):127-130,134. |
| 导热高分子材料在电子封装领域应用研究 |
| Research Advances in Application of Thermally Conductive Polymer Material in Electronic Packaging |
| 投稿时间：2014-04-02 修订日期：2014-09-01 |
| DOI： |
| 中文关键词: 导热材料 高分子 填料 电子封装 |
| 英文关键词: thermally conductive materials polymer filler electronic packaging |
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| 中文摘要: |
| 目的 综述导热高分子材料在电子封装领域的应用 。 方法 首先介绍了目前提高高分子材料导热性能的 2种研究方法， 即制备结构型和填充型导热高分子材料； 其次分别概括了 2种方法制备的导热高分子材料在国内外的研究进展， 尤其对填充型导热高分子材料的研究情况进行了全面综述。 结果 填充型比结构型导热高分子材料在操作实施方面具有更大的优势， 加工工艺简单， 投资成本低， 适用于大多数高分子材料， 是目前制备导热高分子材料的主要研究方法， 而且填料的种类、形状、粒径和表面处理都对提高高分子材料的导热性能有重要影响。 结论 提高高分子基体热导率应充分考虑多种因素的影响，在提高材料导热性能的同时应保证其他性能的稳定，以满足实际生产和生活需求。 |
| 英文摘要: |
| Objective To summarize the application of thermally conductive polymer materials in the field of electronic packaging. Methods Firstly, this article described two methods for preparing thermally conductive polymer materials, namely, structured polymer materials and particle-filled polymer materials; secondly, the development status of the two kinds of preparation methods at home and abroad were summarized, especially the particle-filled polymer materials. Results The particle-filled polymer materials had greater advantages over the other, such as simple processing, low cost, and suitable for most polymers, so it was the main research method for preparing thermally conductive polymer materials; the type, shape, size and surface treatment of fillers all had important influence on improving the thermal conductivity of polymer materials. Conclusion Improvement of the thermal conductivity of polymer matrix should fully consider the impact of various factors, while maintaining the stability of other properties, to meet the actual needs of industry and daily life. |
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