张晓玉,袁玉珍.微电子产品防静电包装材料的研究进展[J].包装工程,2013,34(13):117-122.
ZHANG Xiao-yu,YUAN Yu-zhen.Development Progress of Anti-static Packaging Material for Microelec-tronic Products[J].Packaging Engineering,2013,34(13):117-122. |
| 微电子产品防静电包装材料的研究进展 |
| Development Progress of Anti-static Packaging Material for Microelec-tronic Products |
| 投稿时间：2013-04-30 修订日期：2013-07-10 |
| DOI： |
| 中文关键词: 微电子产品 防静电设计 包装材料 抗静电剂 |
| 英文关键词: microelectronic products anti-static design packaging material anti-static agent |
| 基金项目:山东理工大学重大横向课题(9002-109701) |
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| 中文摘要: |
| 首先叙述了防静电包装与防静电包装材料的概念,对微电子产品的防静电包装设计进行了介绍,并分别讨论了不同种类的抗静电包装材料的特点,简述了微电子产品包装国内外的发展情况,最后指出了微电子产品防静电包装的发展趋势与良好的市场前景。 |
| 英文摘要: |
| The concept of anti-static packaging and anti-static packaging material were first described. Anti-static packaging design for microelectronic products was introduced. The characteristics of different types of anti-static packaging material were discussed. Development status of anti-static packaging for microelectronic products at home and abroad was introduced. Development trend and market prospects of anti-static packaging for microelectronic products were put forward. |
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