李思慧,钱军浩.热转移印刷中承印物热力学性能的研究[J].包装工程,2013,34(1):119-122.
LI Si-hui,QIAN Jun-hao.Research of Substrate Thermodynamic Performance in Thermal Transfer Printing[J].Packaging Engineering,2013,34(1):119-122. |
| 热转移印刷中承印物热力学性能的研究 |
| Research of Substrate Thermodynamic Performance in Thermal Transfer Printing |
| 投稿时间：2012-11-02 修订日期：2013-01-10 |
| DOI： |
| 中文关键词: 热转移印刷 蠕变现象 转印温度 印刷压力 |
| 英文关键词: thermal transfer printing creep phenomenon transfer printing temperature printing pressure |
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| 中文摘要: |
| 热转移印刷中温度及压力是影响印刷质量的关键因素,通过对热转移印刷中承印物的热力学性能研究,分析了承印物在高温条件下的蠕变曲线,以及热转移印刷中转印温度、转印时间及印刷压力对热转移印刷质量的影响,为实际印刷操作中转印温度的控制,转印时间及印刷压力的确定提供理论依据。 |
| 英文摘要: |
| Temperature and pressure of thermal transfer printing are the key factors influencing printing quality. The thermodynamic performance of substrate in thermal transfer printing was studied. The creep curve of the substrate in high temperature and thermal transfer printing quality influenced by transfer temperature, transfer time and printing pressure was analyzed. The purpose was to provide a theoretical basis for determination of transfer temperature, transfer time and printing pressure in actual printing operation. |
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