荆玉焕,张俊坤,高欣宝.箱装电子仪器安全跌落冲击数值模拟方法研究[J].包装工程,2012,33(7):9-12,85.
JING Yu-huan,ZHANG Jun-kun,GAO Xin-bao.Study of Numerical Simulation Method of Electronic Instruments Packaging Drop Impact[J].Packaging Engineering,2012,33(7):9-12,85. |
| 箱装电子仪器安全跌落冲击数值模拟方法研究 |
| Study of Numerical Simulation Method of Electronic Instruments Packaging Drop Impact |
| 投稿时间：2012-02-08 修订日期：2012-04-10 |
| DOI： |
| 中文关键词: 跌落冲击 有限元分析 脆值 |
| 英文关键词: drop impact finite element analysis fragility |
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| 中文摘要: |
| 为正确评估跌落冲击对箱装电子仪器可靠性的影响，确定了合理的包装参数和设计流程，科学指导运输与试验，分别采用理论分析和有限元计算方法对箱装电子仪器垂直跌落的情况进行了仿真，得到了垂直跌落条件下电子仪器最大加速度和最大位移随跌落高度与缓冲垫弹性模量变化的规律。结合产品脆值，确定了产品储运过程中的最大堆垛高度，并得到了合理的包装设计流程，从而为有效指导产品包装设计、实体试验和储运安全提供了理论依据。 |
| 英文摘要: |
| Vertical drop in packaging electronic instruments was simulated using theory and finite element analysis to correctly assess the influence drop impact on reliability of electronic instruments, determine logical packing parameters and design process, guide transportation and experiment scientifically. The changing law of maximal acceleration and maximal displacement of electronic instruments with drop height and elastic modulus of buffer under vertical drop condition was obtained. The maximal height of products in storage and transportation was determined. Logical packaging design process was obtained. The purpose was to provide reference for packaging design, full-scale experiment and safety of storage and transportation. |
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