文章摘要
秦 蓓.有机蒙脱土插层脲醛(OMMT/UF)树脂的制备与性能研究[J].包装工程,2011,32(17):36-40,97.
QIN Bei.Preparation and Property Study of UF Resin Modified with Organophilic Montmorillonite[J].Packaging Engineering,2011,32(17):36-40,97.
有机蒙脱土插层脲醛(OMMT/UF)树脂的制备与性能研究
Preparation and Property Study of UF Resin Modified with Organophilic Montmorillonite
投稿时间:2011-06-08  修订日期:2011-09-10
DOI:
中文关键词: 插层  脲醛树脂  有机蒙脱土
英文关键词: intercalation  UF  organophilic montmorillonite (OMMT)
基金项目:国家自然科学基金项目(50573046);陕西科技厅社会发展攻关项目(2010K17-04-01)
作者单位
秦 蓓 西安医学院 西安 710021 
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中文摘要:
      实验采用十六烷基三甲基溴化铵(CTAB)和十二烷基三甲基溴化铵(DTAB)为改性剂,对蒙脱土(MMT)进行了有机化处理,得到了有机蒙脱土(OMMT),并采用聚合反应过程中的插层复合法制备了有机蒙脱土插层脲醛树脂(OMMT/UF)胶粘剂。通过XRD和SEM对OMMT的结构变化进行表征,结果表明:有机改性剂已进入OMMT的层间,OMMT具有较MMT优良的层间结构。考察了OMMT的投加量对OMMT/UF胶粘剂的各项性能的影响,结果表明OMMT加入量越大,越有利于增强除固化时间以外的各项性能,与UF胶粘剂相比,当OMMT质量分数为3%~5%时,得到的OMMT/UF胶粘剂的表观粘度提高了2倍,耐水时间增加了100 min左右,甲醛释放量降至了5.6 mg/L以下,但是固化时间则增加了近1倍。将OMMT/UF胶粘剂用于胶合板的压制,发现OMMT/UF胶粘剂能够改善板材的强度,同时减少板材甲醛的释放。
英文摘要:
      The montmorillonite (MMT) was treated by cetyl trimethyl ammonium bromide (CTAB) and dodecyl trimethyl ammonium bromide (DTAB) to obtain the organophilic montmorillonite (OMMT), and then the organophilic montmorillonite/urea-formaldehyde resin (OMMT/UF) was prepared by intercalated composite method during the polymerization process. The XRD and SEM showed that the organic reagent has intercalated into the layers of MMT, and the interlayer space of OMMT modified by CTAB and DTAB is larger than that of MMT. The influences of OMMT content on apparent viscosity, water resistance, curing time and free-formaldehyde content were discussed. The results showed that the apparent viscosity is 2 times of UF, the water resistance time of OMMT/UF is 100 min more than UF, the free-formaldehyde content is 5.6 mg/L which is much lower than UF, but the curing time increases to 118 min, when the OMMT content is 3~5%. Plywood prepared by using OMMT/UF as adhesive was discussed, which showed that the OMMT/UF can significantly improve the strength of the plywood and reduce the release of formaldehyde.
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